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新聞集錦

新聞集錦
Jun 12, 2023

芯鼎科技與Valens Semiconductor共同推出多相機視訊會議解決方案

芯鼎科技宣布與Valens Semiconductor合作，基於Valens Semiconductor的CSI-2(Camera Serial Interface 2)高速傳輸延伸技術，共同開發新型多相機視訊會議解決方案。該解決方案採用Valens Semiconductor的VA7000晶片組，可實現長距離快速傳輸且同時接收四組相機的影像串流。這四組獨立的影像串流隨後由芯鼎科技的V57 AI影像晶片進行影像處理，並透過USB3.2介面輸出至後端視訊會議系統。
 
 
多相機視訊會議場景. 圖片來源：芯鼎科技
 

芯鼎科技業務副總 廖文誠表示：「很榮幸能與Valens Semiconductor合作，基於這創新的CSI延伸技術，為音訊和視訊產業帶來革命性的轉變。我們的合作提供視訊會議市場前所未有的解決方案，以具有競爭力的成本提升視訊會議的品質和可靠性，為使用者帶來更好的體驗。」
 
Valens Semiconductor影音部門資深副總Gabi Shriki表示：「Valens Semiconductor很高興能與芯鼎科技合作。VA7000晶片組的CSI延伸技術，是為了實現高速及長距的相機影像傳輸。我們相信芯鼎科技在影像處理和分析的專業，將改變產業對多相機視訊會議系統的設計。期待未來能夠持續與芯鼎科技緊密合作，將這創新的解決方案推向市場。」
 
這項視訊解決方案有望透過實現高畫質且長距離傳輸的影像串流，為客戶提供更靈活且便利的相機安裝方式，以提升專業視訊會議系統到另個新的層次。由芯鼎科技與Valens Semiconductor共同開發的多相機視訊解決方案已經完成驗證，可以讓客戶立即導入應用。
 
若需進一步了解「多相機視訊會議解決方案」請參考Valens Semiconductor於InfoComm 2023的現場展示影片，請點擊以下連結：https://vimeo.com/837019945