At iCatch Technology, we are dedicated to providing comprehensive custom ASIC design services from concept to implementation. Customers can choose advanced semiconductor technology or cost-effective mainstream semiconductor technology based on their needs. Leveraging our in-depth industry insights and cutting-edge technological innovations, we offer high-performance, low-power semiconductor solutions that meet market demands. Additionally, we curate a selection of high-quality proprietary and third-party IPs to cater to a wider range of application needs, helping our customers achieve commercial success.
Our professional design services include:
- IP and Subsystem Design Services
- Solution SoC Design Services
- Production Turnkey Design Services
Customized ASIC Design Flow
iCatch Technology offers full-flow SoC design services from concept to product, flexibly meeting various customer needs. Whether you enter at the Concept-in, Spec-in, RTL-in, Netlist-in, or GDS-in stage, we provide professional services to meet your technical requirements. From system architecture design to final product delivery, we ensure each step precisely aligns with the customer's business and technical goals.
Customized ASIC Design Service Flow
Customized ASIC Design Service SOW
Our Core Technologies
iCatch Technology possesses extensive ASIC design technology and professional experience, including:
- Design Verification Platform Building
- High-Performance Solutions:
- SoC System Level Integration
- Timing Aware Design
- Memory Access Optimization
- Low-Power Technologies:
- Power Aware Design
- Clock/Power Gating
- Multi Supply Voltage (MSV)
- Multi-bit FF, Multi-VT
- Dynamic Voltage Frequency Scaling (DVFS)
- DFT Aware Design
- Memory Built-In Self-Test (MBIST)
- Logic Built-In Self-Test (LBIST)
- Boundary Scan
- ATPG Scan Test
Design for Testability (DFT):
- Functional Safety Design:
- Complying with ISO 26262 ASIL-B/D FuSa Design
- Safety Island Design
- Safety Architecture and Mechanisms Design
- Safety Verification and Confirmation
- Advanced Packaging Solutions:
- Substrate/Interposer Design & Layout
- Electrical & Thermal Simulation
- SiP (PIP, POP) and Multi-Chip Module (MCM)
- 2.5D Advanced Packaging (InFO, CoWoS)